Remote Line Snapshot
Fixed‑fee, remote review of SPI/AOI trends, stencil/paste setup, and recent profiles. 60‑min call + 10‑point action list.
Surface Mount Technology • PCB Assembly • Process Excellence
Data-driven fixes, documented gains.
Remote‑first consulting by default; onsite by arrangement when remote isn’t sufficient.
Remote‑first • Mountain Time (US) business hours • Onsite by arrangement
*Results vary by design, paste, stencil, and equipment condition.
Pick a package or mix-and-match based on your line’s bottlenecks.
Fixed‑fee, remote review of SPI/AOI trends, stencil/paste setup, and recent profiles. 60‑min call + 10‑point action list.
2–3 day onsite assessment: stencil/print, placement, reflow. Includes KPI baseline, quick wins, and a 90‑day roadmap.
Aperture tweaks, squeegee speed/pressure, snap‑off, nano‑coats, support tooling—reduce insufficients and bridging fast.
Tailored profiles for alloys and mass; tombstoning and void mitigation with data‑driven changes, not superstition.
Tighten limits, reduce false calls, and align inspection with real risks. Improve FPY without hiding defects.
DFM/DFX, panelization, tooling, golden board creation, and build‑ready documentation. Hit schedule with confidence.
Short call, share recent builds & KPIs, align on goals and constraints (remote‑first).
Screen‑share sessions, data review (SPI/AOI logs, profiles, paste/stencil), and controlled trials you can run on your line.
Prioritized fixes with owners and timelines. Limited onsite visits available by arrangement when remote isn’t sufficient.
Tell me a bit about your build and goals—I'll reply to schedule a time if needed.